One of the fastest growing segments of the flex circuit market is high density interconnect (HDI) flex. A study by TechSearch International, Inc. (technology licensing and consulting) focuses on demand for HDI flex, defined as circuits with less than 200µm pitch and/or via diameters of less than 250 µm.
The HDI flex circuit applications detailed in the analysis include consumer products such as cameras and camcorders, mobile phones, computers, and computer peripherals such as disk drives and ink jet printers; office automation equipment such as facsimile machines; medical products such as hearing aids, defibrillators, and ultrasound equipment; and liquid crystal display (LCD) modules. Also included in this segment of the flex circuit market are substrates for IC packages such as chip scale packages (CSPs) and ball grid array (BGA) packages.

The study provides a market forecast in volume (square meters) and by dollar value for each HDI application area. For more information, go to http://www.techsearchinc.com.